Shenzhen Techwinsemi Technology Co., LtdStock code: 001309Established in November 2008, headquartered in Futian District, ShenzhenSpecializing in integrated circuits design, research and development, and industrial applicationsFocusing on the consumer and industry application storage marketDeveloping flash memory control chip and firmware solution independently. R&D CenterShenzhen R&D CenterDevelopment of mobile storage main control chipand firmware solution;Overall storage management application solutiondevelopment & technical support.Chengdu R&D CenterDevelopment of various main control chips andhigh-end firmware, customized development forindustry clients, and technical support. Enterprise AdvantageSound R&D SystemR&D TeamGather high-end R&D talents fromChinese Mainland, Taiwan, China, South Korea, Singapore and other places.Rich ExperienceWith over 10 vears of experiencein chip design and management.Leading technology levelAdvanced automatedtesting technologyRich industry resourcesStrong resourceintegration AbilityController chip firmwarescheme and MP tooldevelopment ablilityKeeping a long-term, stable, and largescale procurement channel for NANDFlash storage particles, collaborate,Collaborative cooperation with upstreamand downstream industries,Self-developed memory cardDeeply optimize and integrate marketand technical resources within theUSB controller chip, SSD masterindustry ecosystem, and enjoy highchip related performance in theindustry leading level.Products performancereaches the industry-leading levelvisibility in the industry.Flexible business modeSelf-developed controllerchip + FirmwareFormed chip innovation applicationscovering a complete industrial chainincluding "wafer resource integrationmaster chip design, firmware solutiordevelopment, and storage modulesales ' .We Areone of the few chip designoperation companies in Chinamainland, which masters thesustained & stable storage waferresources and pocesses self -developed controller chipdesign and firmware developmenttechnology in the field offlash memory .Future Plan in Controller ChipTapeout in 2023Achieve full controller coverage of all flash product tvpeFocus on the R&D of controller chip to improve the self-sufficiency rateAccording to different customers and market application scenarios, self-developedhigh-performance, stable and reliable control chip, to satisfy the customer in highspeed, low power consumption and personalized needs oflarge capacity, etc.Meet the development needs of customized productsThrough the optimization and upgrade of software algorithm.tailored for the customer for their specific application requirements of solutions, such ashighly customizable data protection, data reduction, storage management and data securityet .WE WANTFocus on customer application scenarios and improve business layout Future Plan in Main ProductContinuously delving into the originalmobile storage market, furtherincreasing market expansion efforts, and improving the global market layout. The company will leverage the newlymerged high-end solid-state drive andembedded storage product lines, focus on industry customer applicationscenarios, actively layout industrycustomers .On the basis of the company's existing storageproduct line, expand production and intelligentupgrade to expand the company's productionand operation scale. Effectively improve the advanced manufacturingof the company's storage products Level, furtherconsolidate the company's core competitiveness andadvanced manufacturing power.
